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Samsung signs a $200 billion chip deal with Broadcom covering memory, foundry and advanced packaging through 2030

The Next Web

TechnologyThe Next Web·Jul 25, 2026·1 min read

Samsung signs a $200 billion chip deal with Broadcom covering memory, foundry and advanced packaging through 2030

Samsung Electronics and Broadcom have signed a memorandum of understanding worth more than $200 billion spanning memory chips, foundry manufacturing and advanced packaging for artificial intelligence semiconductors. The deal, announced on…

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