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SK Hynix breaks ground on a $4B memory packaging hub in Indiana

The Next Web

TechnologyThe Next Web·Aug 27, 2026·1 min read

SK Hynix breaks ground on a $4B memory packaging hub in Indiana

SK Hynix has broken ground on a plant costing more than $4B in West Lafayette, Indiana, its first US base for packaging high-bandwidth memory, with production due in the second half of 2029. Intel’s equivalent assembly and testing plant…

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