Bloomberg
Meta-Tied Data Center Taps US Junk Bonds for the First Time
CleanSpark Inc. is seeking to borrow roughly $2.23 billion through a junk-bond offering to fund artificial intelligence infrastructure tied to Meta Platforms Inc..
View original source — Bloomberg ↗
Related stories
Bloomberg
TechnologyJun 8, 2026 · 1 min
Cipher Sells Junk Bonds to Fund Amazon-Tied Data Center Project
Bloomberg
Bloomberg
TechnologyJun 5, 2026 · 1 min
TeraWulf Eyes Leveraged Loans After Data Center Bond Market Win
Bloomberg
The Next Web
TechnologyJun 8, 2026 · 1 min
Cipher Digital raises $810 million in junk bonds to build another Amazon data centre in Texas
The Next Web
Bloomberg
TechnologyJun 8, 2026 · 1 min
Amazon Seeks to Raise at Least C$7 Billion in Canada Bond Sale
Bloomberg